TSMC and Samsung have announced an unprecedented partnership to co-develop unbuffered HBM4 memories – which will be used in upcoming artificial intelligence chips, reinforcing the two companies’ presence in this competitive industry.
The reveal was made during SEMICON Taiwan 2024, bringing together a previously unlikely union. The proposal is to further strengthen their position within the AI market – which is constantly evolving and will require many to put aside their differences to work together in order to continue maintaining their space.
Samsung is the largest memory manufacturer on the planet, while TSMC is the largest chip manufacturer on the planet – which promises unprecedented production for unbuffered HBM4 memory.
The move is interesting as Samsung previously produced its own HBM4 memory, while TSMC was part of a “triangular alliance” with SK Hynix and NVIDIA for AI designs as well as future HBM memories.
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Expanding alliances for HBM4
According to Samsung’s corporate president and head of memory division Lee Jung-bae, the future of HBM4 and other production is “joint.”
To maximize the performance of AI chips, custom HBM will be the best option. We are working with other major manufacturers to offer more than 20 customized solutions.
Lee Jung-bae
The process to bring HBM4 without buffer
Production of HBM4 memory is a bit different than what was seen with HBM3 and HBM3E versions – with a design revolving around the logic die, which will act as the “brain” of the chip. It will be carried out by foundry companies rather than seeing memory manufacturers producing them themselves, as has typically been seen in the past.
Until now, Samsung had revealed that it was producing its own logic dies for HBM4 memories – using its in-house 4nm process. However, it will do so differently with the support of TSMC. The intention is to take advantage of the semiconductor giant’s advanced technologies and also have help in reaching the Taiwanese company’s customers.
Fonte: TweakTown
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Source: https://www.adrenaline.com.br/samsung/tsmc-e-samsung-se-unem-para-produzir-memorias-hbm4/
