A startup of the United States, in collaboration with the Sandia Laboratory, is developing a cutting -edge technology capable of cool high performance chips with laser bundles.
Maxwell Labs’s proposal seeks to soften extreme heat points and also convert part of this thermal energy into reusable electricityan advance with the potential to change energy efficiency patterns in date centers and high performance computer systems.
Microscopic accuracy in combating heat
Unlike traditional methods – such as forced air, liquid cooling or immersion – the new system Uses cold plates made of gallium arseneto (gaas)a semiconductor material of very high purity.
The plates are activated by coherent laser beams with specific wavelength. Instead of warming, as usually occurs when intense light reaches materials, Gaas responds cooling critical zonesthanks to its high electronic mobility.
Now, what is not that mobile is the machine that Maxwell Labs uses in the tests, with technical support from Sandia National Laboratories:
Therefore, here we have an answer to take the horse out of the rain from those who thought the fans will be retired anytime soon: the proposed method does not intend to replace current cooling systems, but act complementaryfocusing on areas that really accumulate more heat in the chips.
The technique employs microstructures within the semiconductor plates that channel lasers directly to the hottest points processors, cooling them in a highly localized way.
The approach goes back to previous experiments, such as a study by the University of Copenhagen in 2012, where membrane was cooled to -269 ° C using similar method, close to Zero absoluto.
Recycled Energy: Heat becomes electrical source
In addition to localized cooling, the system also recovers part of the energy removed in the form of light (More precisely, photons), which can be converted again into electricity.
By redirecting heat for reusable photonic energy, this technology can transform the way energy efficiency is treated into data centers
In other words, instead of simply dispersing heat in the environment, the system Take advantage of the thermal surplus as an energy sourcewhich could contribute to reducing overall energy consumption in high processing environments.
However, data on the real efficiency of this energy conversion have not yet been demonstrated in physical tests.
Why Galio Arsento? The unique properties of the key material of innovation
O Galio Arsento (Gaas) It is a compound semiconductor that stands out for electronic and optical properties superior to those of traditional silicon. Although it is more expensive and complex to manufacture, its unique physical and chemical characteristics They make it a strategic choice for high performance applications – such as lasers, solar cells, and now high precision cooling systems.
Among their differentials, are the High mobility of electronswhich allows driving electrical charges with greater efficiency and less energy loss. That is, the gaas responds faster and more accurately to external stimuli (such as beams of light), allowing him absorb and redirect heat with high precision.
Another vital property of Gaas is yours ability to operate at very high frequencies and better deal with high temperature environments without degrading your performance.
In addition, it is a material that can efficiently issue photonsa feature explored in the process of light energy recovery in the form of light – a vital step in the system developed by Maxwell Labs.
Industrial challenges: cost and complexity
Despite the enormous potential, the proposal faces significant barriers. The main challenge lies in the manufacture of ultrapuro gallium arsenide plates. For this, advanced techniques are required as Epitaxis by molecular beam (MBE) e Chemical deposition of metal-organic vapor (MOCVD) – Processes that are not only energetically expensive but also result in high defect rates.
Currently, a 200 mm gaa wafer can cost about US$ 5.000while the silicon equivalent comes out for only US$ 5. Furthermore, Gaas is not directly compatible with silicon chipsrequiring expensive methods such as heterogeneous 3D integration or wafer bonding to work with conventional chiplets.
Prototyping and market perspectives
Maxwell Labs is still in the simulation phase and tests of individual components. There is no complete functional prototype so far. According to the company’s CEO, Jacob Balmathe models indicate encouraging results, but there are still practical tests.
The expectation is that the first operating prototype is completed until the spring of 2025. Meanwhile, the initial version of the system, called MXL-Gen1has already attracted interest from some pioneer partners.
The startup intends to deliver pilot units in the next two years, with broader commercial launch scheduled for the end of 2027if all goes as planned.
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Will you get to my PC? Not so early
Despite the full potential of this laser technology, it is essential to say that its use is, for now, restricted to high performance environmentsas data centers, supercomputers and scientific or military applications. The necessary investment, in both materials and integration, makes the system Unfeasible for desktops or conventional notebooks.
However, It is not impossible to imagine That, if commercial success, simplified and cheap versions of this type of technology can be developed for specific niches – especially on local AI, intensive workstations or extended reality. But until then, dissipping, fans and Water Coolers will continue to dominate the scenario of personal computing.
Fonte: Maxwell Labs e The Register
Source: https://www.adrenaline.com.br/tech/maxwell-labs-coolers-lasers-futuro-resfriamento-de-processadores/
