SK Hynix has signed a document promising $450 million in investment and access to $500 million in loans from the U.S. Department of Commerce through the CHIPS and Science Act. All of this money will go toward a new advanced memory packaging plant, which will be located in Indiana.
The US’s goal is to ensure that even more technology corporations set up their facilities in the country, this one in particular with an interest in bringing its supply of HBM memories to the domestic market – essential for HPC processors and also artificial intelligence.
If SK Hynix goes ahead with the agreement and the project comes to fruition, it is expected to begin operations in 2028 and will create 1,000 jobs. The estimated cost of the plant is $3.87 billion and it is intended to be one of the largest producers of advanced packaging in the world.
In addition to the $950 million the company can obtain from the CHIPS and Science Act, the manufacturer is also seeking a tax reduction of up to 25% on qualified capital expenditures – which can be obtained through the US government’s Investment Tax Credit program.
Given the timeframe SK Hynix expects to have its new Indiana plant up and running, it is likely to produce HBM4 memories or even HBM4E modules, which will require sophisticated packaging techniques.
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SK Hynix and US Interests
The construction of a HBM4/HBM4E plant in the United States is strategically important not only for the U.S. government but also for SK Hynix. Given that both parties will benefit from the deal, it is likely that the agreements will be signed without too many obstacles.
While the factory is not ready, HBM4 memories must be produced outside the United States – being produced in South Korea, where the manufacturer’s main base of operations is currently located.
In addition to the proposal to manufacture HBM4 memory and, potentially, its successors, SK Hynix is ​​also interested in partnering with research institutions such as Purdue University – seeking to develop advanced semiconductors and more advanced techniques for chip packaging.
Source: Tom’s Hardware
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Source: https://www.adrenaline.com.br/tech/sk-hynix-garante-950-milhoes-dos-eua-para-fabrica-em-indiana/
