Credits: Disclosure/AMD

Huawei, in partnership with semiconductor manufacturer Wuhan XMC, intends to produce HBM memories with the aim of taking advantage of the growing demand for the product in artificial intelligence accelerators.

Hardware is one of the main components of these accelerators, and is the main focus of other large corporations such as Samsung, SK Hynix and Micron. The Chinese company has decided that it wants a share of this race too and promises to bring its products to market in 2026.

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Huawei’s intention is to fuel China’s AI market, helping the country become increasingly self-sufficient in this sector. Among its other projects that promise to leverage the country’s technology is the Ascend AI chips – generating even more strength to overcome the sanctions imposed by the United States.

According to DigiTimes, Huawei’s HBM memories will be produced by Wuhan XMC and with the support of companies such as Jiangsu Changjiang Electronics Technology (JCET) and Tongfu Microelectronics – the latter responsible for water packaging and CoWoS.

This isn’t the first time China has tried to enter the race, with XMC – a subsidiary of YMTC – having previously established a factory that produces 3,000 12-inch wafers per month. It was not disclosed whether the R&D teams are already at a more advanced stage or if the project is still in its early stages.


Huawei wants to enter the race for HBM

It is not surprising to see that Huawei also wants to produce its own HBM memories, considering that the leaders in this market – SK Hynix, Micron and Samsung – have achieved great progress in these technologies and are seeing that they are the main choice for AI accelerators – whether from NVIDIA, AMD, Intel and other manufacturers.

Even though China is still far from achieving a technological leap like that seen in other countries – largely due to sanctions imposed by the US – it is a promising development for the country and will help it to become less dependent on external supplies.


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