Zen 5-based Ryzen 9000 CPUs feature 8.315 billion transistors

AMD has revealed the die size and 8.315 billion transistor count present in Zen 5 architecture chips used in its next-generation processors, the Ryzen 9000 series. The information was released by company representatives to HardwareLuxx, so it is official.

The data highlights that the die for the new CPUs measures 70.6mm², practically the same size as the 71mm² die in the Ryzen 7000. Thus, the transistor count, which jumped from 6.5 billion in the last generation to more than 8 billion in Zen 5, represents a 28% increase in component density. This shows the difference that 1nm makes in the manufacturing process of products.

The folks at Tom’s Hardware point out that the Ryzen 7000s were manufactured on TSMC’s N5 process, meaning they use a 5nm lithography process. Meanwhile, the Ryzen 9000s are being manufactured using the same company’s N4P technology, using a 4nm process. The result is a much higher density of transistors: 117.78 million per mm², compared to 92.9 million in Zen 4.

The new information complements the details that AMD had previously released for the Ryzen 9000 series. However, the company went further and also talked about the dies for its Hawk Point and Strix Point APUs.

Zen 5 is not limited to the Ryzen 9000 series

Still speaking to the German website, AMD took the opportunity to reveal the die sizes of its Zen 5-based APUs. Unfortunately, however, the company did not disclose the number of transistors for these processors, as it did in the case of the Ryzen 9000. Check it out below:

• Hawk Point 1: 178mm²
• Hawk Point 2: 138mm²
• Strix Point: 232,5mm²

They are much larger in size, but that is what is expected of APUs, since they incorporate more elements into the final product. Still, the Strix Point certainly attracts a lot of attention, being one of the largest APUs that AMD has made in recent years. To check out more details about these models, just click here.