TSMC stated during a meeting with investors that its capacity to produce with advanced CoWoS technology will double in 2024. Not only that, this capacity will double again in 2025, according to the company. However, even after this increase, customer demand will continue to be greater than the manufacturer’s production.
The Taiwanese semiconductor manufacturer did not offer concrete figures on its CoWoS production, but the website Money DJ claims to have inside information. They claim that the capacity to manufacture with the technology should reach between 35,000 and 40,000 wafers in 2024. This way, this number would reach 80,000 in 2025.
Previous speculation estimated that TSMC’s CoWoS capacity would slow its growth in 2026, reaching 100,000 to 120,000 wafers that year. However, strong customer demand that has not yet been met may have caused the company to boost its investments. Thus, there are new estimates of 140,000 to 150,000 wafers in 2026.
As it struggles to meet demand from its many customers, TSMC still grapples with small profit margins on advanced chip “packaging” technologies. Apparently, these processes deliver lower than average margins for the company, but the numbers would be continually improving for TSMC, which is why the company believes it is worth the investment.
TSMC needs to expand its production to avoid losing customers
TSMC’s rush to expand its production capacity in CoWoS comes from concerns about losing contracts from large customers. The largest tech companies in the world work with the Taiwanese manufacturer due to its advanced chip production, but its partners will not want to wait in a “queue” to obtain their orders.
Related news:
There are rumors that AMD is already looking for alternatives, while the CEO of NVIDIA has openly stated that there will always be the possibility of seeking new partnerships, if necessary. However, it is interesting to remember that the executive highlighted in the same speech that he considers TSMC to be the best chip manufacturer today, by a large margin.
Fonte: TechPowerUp
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Source: https://www.adrenaline.com.br/hardware/capacidade-para-cowos-da-tsmc-vai-dobrar-em-2024-e-2025-mas-ainda-nao-alcanca-demanda/
