TSMC is expanding its facilities in Taiwan, changing the focus of Advanced Packages (System-On-Integrated Chip) technology. This breakthrough is driven by the expectation that Nvidia, AMD, and Apple Lancem solutions based on this layout by the end of 2025 and early 2026.
Soic encapsulation is an advanced technique that allows the integration of multiple chipples (CPU, memory and I/O) into a single highly functional package. With her, Several chips, such as CPU, memory and I/O, can be mounted on a single chip, allowing greater flexibility in chip design and optimization for specific applications.
Soic technology has already been seen in AMD’s 3D V-Cache CPUS. In these chips, the additional cache memory is vertically on the processor chip, and it seems that Nvidia and Apple are planning to use technology.
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NVIDIA e Apple
Nvidia’s Rubin line is expected to employ a courtesy design of the functional HBM4. The information is that the Vera Rubin NVL144 platform features GPU Rubin With up to 50 PFLOPs of FP4 and 288 GB of HBM4 memory of the latest.
NVL576 will feature a Rubin Ultra GPU will offer up to 100 pflops of FP4 and a total HBM4E capacity of 1 tb spread over 16 hbm sites.
Apple also plans to adopt the standard and information is that the state -of -the -art M5 chip uses the Soic encapsulation and is integrated into Apple’s AI servers. Details about the M5 chip are scarce for now, but it is known that the chip will be used in future iPads and MacBooks.
TSMC context
The expectation is that The Taiwan giant reaches production numbers of up to 20,000 for SOIC encapsulation until the end of 2025. However, the main focus will still remain in Cowos until at least Nvidia Rubin reaches the market, which should occur between the end of 2025 and the beginning of 2026.
TSMC already has a great demand for the new generation of its 2NM chips lithography. And it is speculated that, as usual, Apple will be the first to order chips for its A20 processor. It is expected to debut on iPhone 18, scheduled for the second half of 2026.
The company is also expanding its factories, with the installation of FAB21 in Arizona being one of the examples of this expansion. And, according to information from US analysts, the cost of production should not exceed 10% compared to production in Taiwan.
Fonte: Wccftech e Ctee.
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Source: https://www.adrenaline.com.br/hardware/tsmc-planeja-aumentar-a-producao-de-chips-com-soic-ate-o-final-de-2025/
