TSMC accelerates research on glass substrates for NVIDIA

TSMC, Intel, Samsung Electronics, AMD and even Huawei have been investing heavily in research and development to use glass substrates in their semiconductor production, but NVIDIA’s demands and requirements may accelerate this process a little further from now on.

To meet the constant advancement of artificial intelligence technology, the Taiwanese company stated that it is already developing glass substrates for future FOPLP packaging – with the promise of bringing several benefits, such as an increase in die size and transistor per area ratio.

Although there is still a long way to go before these glass substrates can be effectively used, TSMC wants to move forward to catch up with Intel – as the corporation recently released its plans for use over the next ten years and stated that it already has the capacity to mass produce them, putting it ahead of the competition.

However, TSMC apparently isn’t too “concerned” about this lead taken by its competitors. Considering its competence and reliability within the market, the rival’s announcement didn’t have much of an effect on the Taiwanese giant – since both NVIDIA and its other business partners trust its products.

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According to DigiTimes, several Taiwanese manufacturers see the plans to bring glass substrates to TSMC as an “investment in the future.” Companies like Titanium have joined the initiative called “E Core,” bringing together all equipment manufacturers to supply the materials in one place.

As artificial intelligence becomes the next step, glass substrates are expected to play a key role in the coming years. The solution is expected to hit the market from Intel and TSMC between late 2025 and early 2026 – with both companies maintaining a lead over their competitors.

Fonte: WCCFTECH