They succeeded: Intel wins a milestone with WAFERS 18A production of 1.8 nm in the USA

Shortly after the announcement of the new CEO and a climb to the actions, Intel took another significant step in the semiconductor race by starting Wafers production in its 18a (1.8NM) process at the Arizona factory.

The transition marks the transfer of technology, previously tested on Oregon, to one of the company’s high volume facilities, FABS 52 and 62.

The change represents a relevant achievement, as Intel has been betting on the 18th process to recover its leadership position in industry, which faces unprecedented competition from the Asian.

Technology uses new ribbonfet transistors and a rear power delivery system, designed to increase energy efficiency and improve chip density.

Announcement was made by Intel engineer

The news of this advance was released by Pankaj MarriaIntel Engineering Manager, in a post at LinkedIn.

He highlighted the role of the “Eagle Team” team (Eagle Team) in the lead of the achievement and celebrated the beginning of production in Arizona. In its publication, Marria wrote:

Proud to be part of Eagle Team, leading the way to bring Intel 18a to life technology! Our team was at the forefront of the production of the first lots right here in Arizona, marking a fundamental step in the evolution of the manufacture of tip semiconductors

Innovative differentials of the Intel 18a process

No wonder the Intel 18a project represents one of the largest advances in the manufacture of semiconductorssince it is the first under-2NM technology developed and produced in North America.

1. Main improvements of Intel 18a

• Up to 15% more performance by Watt e 30% higher transistor density compared to Intel 3.
• PowerVia: The first commercial implementation of rear energy delivery technology.
• RibbonFET: The adoption of Gate-All-Around architecture, allowing greater control of the electric flow.
• HD Me Capacitors: Significant improvement in stability of tension, essential for demanding workloads such as generative AI.
• Total compatibility with EDA tools and reference flowsfacilitating the transition from other manufacturing technologies.
• Strategic partnerships with more than 35 leading companies to accelerate the adoption of the new technological node.

2. Powervia: Power delivery technology for the rear

This is Intel’s exclusive innovation that revolutionizes the way energy is delivered to transistors within a chip. In traditional processes, control signs and energy distribution compete for space on the front of the wafer, leading to congestion and increased electrical resistance.

Characteristics do powervia

• Relocation of energy lines For the rear of the chip, freeing up space on the front to control and communication signs.
• Reduction of energy delivery resistanceimproving efficiency and allowing higher frequencies.
• Increased standard cell density by 5-10%optimizing the space in chip design.
• Improvement of up to 4% in ISO-POWER performancereducing the impact of voltage drop (IR drop) in relation to traditional energy delivery designs on the front.

Thus, this power delivery method completely separate the signal and power pathsresulting in lower interference and greater operational stability.

Remember that Intel is the first company in the semiconductor industry to implement this technology on an industrial scale.

3. RibbonFet: The new generation of Intel transistors

Ribbonfet is the implementation of Intel of Technology Gate-All-Around (GAA)which replaces the traditional finfets. While finfets used a single “fin” to control the stream of current, GAA transistors use Multiple “Ribbons) wrapped by Gateallowing a more accurate control of the electric current.

RibbonFet Advantages on Finfet

• More strict transistor channel controlreducing current leakage and allowing more efficient designs.
• Best performance by Wattproviding greater energy efficiency.
• Low voltage (Vmin) operations optimizedresulting in less energy consumption.
• Greater flexibility in designallowing different tape widths to optimize performance and energy consumption.
• Lower electrostatic interferenceensuring stability even in higher densities of transistors.

Ribbonfet transistors are essential to achieve Process We below 2 Nmand Intel adopted this technology in its 18th architecture.

New direction and impact on the market

While the company advances in its production roadmap, Intel also undergoes strategic changes. Recently, Lip-BU Tan was appointed as the company’s new CEO, leading to an increase in stock value.

Under its leadership, which will start on March 18, Intel is focused on drawing a plan so that its factories are a really competitive alternative against TSMC, while still working with the Taiwanese manufacturer to meet market demands.

Intel’s advance also attracts attention from large players. Reports indicate that companies such as Nvidia and Broadcom are conducting tests with Intel’s process 18a, which can further strengthen the company’s position in the Foundries sector.

In addition to the private sector, the US government has also shown confidence in Intel’s potential. The company has received an investment of $ 3 billion to provide 18A Chips to the US Army, building a semiconductor domestic strategy and reducing dependence on foreign suppliers.

The arrival of the 18a wafers in Arizona is a historic milestone for Intel and the US semiconductor industry. We are paving the way for a new era of innovation and energy efficiency

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The future of 18th technology

With the first wafers running at Arizona, Intel prepares for the mass production of their upcoming chips, including Panther Lake processors and Xeon 7 chips for data centers. If successful, the initiative can redefine the industry by placing Intel in a more competitive position against TSMC and other manufacturers.

Source: Tom’s Hardware