A Sony published on Monday (22) an official disassembly of the PlayStation 5 Propresenting technical details and comparisons with the previous models of the same generation. The images came directly from PlayStation, with the engineers Shinya Tsuchida e Shinya Hiramitsu explaining the design and internal architecture of the new console.
The purpose of the presentation was to highlight how the PS5 for differs do PS5 original (2020) and PS5 Current (2023), both in processing capacity and in thermal and structural solutions.
Disassembly, performed in a controlled environment and with clear guidelines that the procedure invalidates the warranty, revealed important adjustments in virtually all internal components of the new console.
From external housing to the power supply, the PS5 for It is designed to deal with higher performance requirements and thermal dissipation, according to the brand.
New external design optimizes air flow
The first remarkable change is chassis design. THE PS5 for It has three horizontal lines on its sides, named “blades” by engineers, who act as additional air inlets and outputs, not present in the previous models.
These openings were integrated into the console’s visual design and also have a practical function: reinforcing the internal cooling system.
The structure also has “praise” fins, positioned between the outer lid and the body of the console.
These pieces help to direct the fan noise away from the front of the device, considering that most players position the PlayStation 5 Pro with the front facing you.
Changes in rear and denser components
The rear of the console also underwent changes compared to the PS5 Current. HDMI, LAN and USB ports have been repositioned to accommodate the new motherboard layout, which now has the highest circuit density.
The rear air outlet is also wider, ensuring that the increase in heat generated by more powerful components is properly dissipated.
Another relevant change is in the position of the buttons and connections. The power button, for example, was placed at the bottom of the console when it is vertically, facilitating access. These decisions were made after testing and discussions between engineers and designers.
Reckless and silent
The fan of PS5 for It was also redesigned. Although it keeps the same number of paddles as the previous model, the new blades have alternate geometries, with smaller blades among the largest.
According to PlayStation, this allows higher air volume with lower noise level, which, according to engineers, is essential for the user experience during games.
Redet and more powerful motherboard
When removing the internal metal protectors, the engineers showed the new motherboard do PS5 forwhich is larger than that of PS5 Current. This is due to the need to accommodate more circuits to support the increase in graphic performance.
O SoC (System on a chip), responsible for graphic processing and support PlayStation Spectral Super Resolution (PSSR)occupies the center of the plate. The plate structure has more internal layers, which improves memory performance and reduces external interference.
A revealed detail is that the PS5 for Now uses nine memory chips, instead of the eight present in the previous models.
The additional DDR5 chip is responsible for system management, while the eight GDDR6 They continue to deal with intense graphics tasks. The change aims to release more features for games, optimizing overall performance.
The technology of Liquid metaladopted since the PS5 originalit was maintained in the new model, but with some improvements. Sony added grooves around the application area to increase the stability of the compound.
This solution is still one of the main responsible for efficient thermal conduction between the processor and the heat sink. Since the PS5 base at the launch, this is one of the main highlights of the console cooling system, as other models use the traditional thermal paste.
Redesigned power supply and sink
The energy consumption of PlayStation 5 Pro increased in about 48 watts compared to PS5 Currentrequiring a power supply more robust. The unit was designed with a specific curved format to adjust to the chassis.
Already the heat sinkmade of copper, aluminum and steel, brings a larger number of conducting tubes and finished fins to optimize dissipation.
Source: PlayStation Blog.
Source: https://www.adrenaline.com.br/games/playstation/sony-mostra-playstation-5-pro-desmontado-ao-lado-do-playstation-5/
