SK Hynix presented, during TSMC at Technology Symposium, its innovative HBM4 technology, reaffirming its supremacy in the advanced memories market.
With capacity for Stack up to 16 layers and reach impressive 2.0 tb/s of bandwidth, The South Korean company intends to start mass production in the second half of 2025.
Unpublished advances in HBM4 put SK Hynix in front of the competition
While competitors like Samsung and Micron are still in sampling phases, SK Hynix went ahead by publicly showing its ready -to -market HBM4.
The new technology offers capacity of up to 48 GB e 8.0 Gbps I/O velocity, demonstrating advances that can revolutionize the artificial intelligence sector and data centers.
According to the company, it is expected that HBM4 will be integrated with commercial products by the end of 2025, anticipating its adoption by technology giants.
16 layers of innovation: MR-MUF and TSV raise the standard
SK Hynix also had its 16 -layer HBM3E solution, the first of the type, reaching 1.2 tb/s bandwidth. This memory should be used in NVIDIA’s new AI clusters, Codiname GB300 “Blackwell Ultra”.
To stack so many layers, the company used advanced encapsulation techniques such as MR-MUF (Molded Underfill) and TSV (through-silicon via).
We developed our new memory modules to boost efficiency in artificial intelligence and data centers, without compromising energy consumption
Representative da Sk Hynix
Technology also positions the company as a reference in new high demand applications.
New memories for servers: RDIMM and MRDIMM of very high performance
In addition to the news in HBM, SK Hynix has unveiled its new memory modules for server, which promise to transform data centers performance. With based on the process 1c DRAMnew generations of RDIMMS and MRDIMMs reach speeds of up to 12,500 MB/s.
The main highlights include:
- MRDIMM up to 12.8 Gbps, with capacities of 64 GB, 96 GB and 256 GB.
- RDIMM Operating at 8 Gbps, available in 64 GB and 96 GB versions.
- One 3DS RDIMM 256 GB, aimed at Critical AI operations and large databases.
Also read:
Strategic partnerships guarantee competitive advantage
Collaboration with giants such as Nvidia reinforces the dominant position of SK Hynix. The company bets on continuous innovation and strategic relationships to lead the next generation of AI memories, surpassing traditional competitors in the sector.
Fonte: SK hynix
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Source: https://www.adrenaline.com.br/hardware/sk-hynix-primeiro-modulo-hbm4-do-mundo/
