Sandisk announces partnership with SK Hynix for standardization of HBF memories

Sandisk is one of many companies in the race for a new memories technology that can face HBM and enjoy increasing AI investments. The company’s solution is the HBF – High Bandwith Flash memories, and now the company has made an important partnership in standardizing its components.

SK Hynix, one of the world’s three largest memories manufacturers has signed a Memorandum of Understanding (MOU) to define the requirements and standards for creating an HBF -based ecosystem, completely necessary if Sandisk wants wide adoption of its new technology.

“This collaboration accelerates innovation and will offer the industry new tools to deal with exponential demands for tomorrow’s applications,” said Sandisk’s Alper Ilkbahar. “Our work will help offer an effective solution to meet the technology needs of the world and exceed the expectations of our respective customers.”

Obviously, AI use was widely mentioned in the announcement of the partnership between the two companies. Models have been larger and more complex, requiring more and more memory, which increases the costs of implementing and maintaining components.

“Through our work with Sandisk to standardize the High Bandwith Flash (HBF) specification, we are actively contributing to the commercialization of this innovative technology, which we believe to be the key to unlocking AI’s full potential and the next generation of data,” said Hyun Ahn of SK Hynix.

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Sandisk has reiterated in its post about the partnership that HBF modules should offer “comparable” band to HBM, while delivering 8 to 16 times more capacity for the same price.

The company expects to deliver the first HBF memories samples in the second half of 2026, with the first AI accelerators equipped with the technology arriving in early 2027.

Via: TechPowerUp