Samsung produces modules of up to 16 GB of RAM for smartphones

Samsung announced this week that it has started mass production of its 12nm-class LPDDR5X DRAM packages. These are the thinnest in the industry and come in 12GB and 16GB capacities. According to the manufacturer, they are aimed at the premium smartphone market.

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These ultra-thin modules, just 0.65 millimeters thick, are designed to improve thermal control. This way, Samsung would be able to better use the additional space left over in smartphones for other purposes.

As artificial intelligence (AI) applications in devices become more common, effective temperature management is increasingly crucial. Samsung’s new LPDDR5X DRAM package features a four-layer structure that reduces its thickness by 9% and increases heat resistance by approximately 21.2% compared to Samsung’s previous generation of DRAM.

Samsung innovates in design and thermal resistance

PCB design, epoxy molding techniques, and back-lapping processes were used to achieve the reduced thickness of DRAM packages. This configuration not only improves airflow management within the devices, but can also result in cooler devices during intensive use.

Additionally, Samsung revealed plans to develop 24GB and 32GB modules in six-layer and eight-layer structures, respectively, for future devices. These high-capacity packages could power future Copilot+ PCs, offering a new class of AI capabilities.

“LPDDR5X DRAM sets a new standard for high-performance AI solutions on devices, delivering not only superior LPDDR performance but also advanced thermal management in an ultra-compact package,” said YongCheol Bae, Executive Vice President of Memory Product Planning at Samsung Electronics.

Fonte: Neowin