Samsung plans to use glass substrates in the manufacture of chips by 2028

Samsung finally published an official roadmap where it mentions its plans to enter the race for the use of glass substrates instead of silicon in the manufacture of its chips. Other giants such as TSMC, Intel and AMD are already looking for the use of the material, and now the South Korean company wants to start packing its semiconductors with glass interposers by 2028.

As always the demand for AI products is cited as a great motivator for advancement. Increasing costs in increasingly advanced chips encouraged Samsung to move to glass substrates, which offer more accurate circuit creation, while cheaper.

According to WCCFTECH, Samsung is aiming at glass units below 100 x 100mm, a much smaller measure than its competitors, which work with 510 x 515mm. The small size would result in less efficiency in productive capacity, but it would be a way Samsung found to enter the segment faster.

Samsung seeks to rekindle his Foundry segment

Samsung’s chip manufacturing segment has faced difficulties in recent times, something that has even generated speculation about the possibility of the company to give up this market completely.

However, the last leaks show that the Galaxy owner still intends to invest a lot in the area before playing the towel. If the manufacturer actually goes ahead with packing with glass interposers, it may be the advantage she needs to stand out and secure customers among the largest technology companies in the world.

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Also, later this weekend we also had the rumor that the company can be able to become the chip manufacturer for the next portable PlayStation. Coincidentally or not, the production forecast is for 2028 as well, so the year should prove fateful for the future of Samsung Foundry.