A Qualcomm took advantage of the spotlight at CES 2026 to renew its commitment to the notebook segment with the official announcement of Snapdragon X2 Plus.
Designed to equip the next generation of machines with Windows on ARM, the new chip promises to democratize access to cutting-edge technologies, maintaining the focus on energy efficiency that enshrined the architecture.
The big news is the introduction of two different variants — with 10 and 6 cores — aiming to cover a more accessible price range without sacrificing artificial intelligence resources.

Jump in performance and multi-day battery life
Manufactured on a lithography 3 nanometersthe new SoC (System on a Chip) brings the third generation of CPU cores Oryonwhich according to the manufacturer, delivers an increase in 35% em performance single-core compared to the previous generation.
The focus on mobility remains central: Qualcomm claims that the component consumes 43% less energy than its predecessorenabling what the company calls “multi-day battery life” in moderate use.

The big difference of this intermediate line is the maintenance of the NPU (Neural Processing Unit) Hexagon high performance.

Even in the cheapest versions, the chip delivers 80 TOPS of capacity for local AI processing, a 78% jump compared to the previous generation.
This ensures full compatibility with ecosystem resources Microsoft Copilot+, including live captions and generative authoring tools.

Specifications: 10 cores vs 6 cores
The company’s strategy divides the Snapdragon X2 Plus in two main models: the X2P-64-100 (10 cores) and the X2P-42-100 (6 cores).
Both share the same memory and NPU architecture, but differ in integrated GPU operating frequencies Adreno X2-45. Check out the details below:
| Specification | Snapdragon X2 Plus (10-core) | Snapdragon X2 Plus (6-core) |
|---|---|---|
| Model | X2P-64-100 | X2P-42-100 |
| CPU Cores | 10 | 6 |
| Cache Total | 34 MB | 22 MB |
| Max Frequency | 4.0 GHz | 4.0 GHz |
| GPU | Adreno X2-45 (1.7 GHz) | Adreno X2-45 (0.9 GHz) |
| Napu | 80 TOPS | 80 TOPS |
| Memory | LPDDR5x (9523 MT/s) | LPDDR5x (9523 MT/s) |
In graphics terms, the new GPU promises a gain of 29% em performance, supporting modern APIs like DirectX 12.2 Ultimate and Vulkan 1.4. This should allow for a satisfactory experience in light gaming and video editing tasks, although the focus of the hardware continue to be productivity and media consumption.

During the presentation, Qualcomm did not spare direct comparisons with the x86 competition. Data released by the company indicates that the 10-core model surpasses the Intel Core Ultra 7 265U (Lunar Lake) entregando 3.5 times more performance with the same power consumption (ISO power).


In peak scenarios, the single-core advantage would reach 28% over its rival.
Against a AMD and its Ryzen AI processors, the X2 Plus seeks to position itself as the most efficient alternative per watt.
The battle for the mid-range notebook segment is likely to intensify as ARM-based solutions continue to gain maturity in software and driver compatibility.

Complete technical sheet of the Snapdragon X2 Plus
General identification
| Item | Detail |
|---|---|
| Platform | Snapdragon X2 Plus |
| Manufacturer | Qualcomm |
| Series | Snapdragon X Series |
| Segment | Ultramobile PCs with AI |
| Part numbers | X2P-64-100 / X2P-42-100 |
Processor (CPU)
| Item | Specification |
|---|---|
| Name | Qualcomm® Oryon™ (3rd generation) |
| Architecture | 64-bit |
| Number of cores | 10 cores (X2P-64-100) / 6 cores (X2P-42-100) |
| Maximum frequency | Up to 4.04GHz |
| Core type | Prime + Performance cores |
| Cache total | Up to 34 MB (64-100) / 22 MB (42-100) |
Graphics processor (GPU)
| Item | Specification |
|---|---|
| Name | Qualcomm® Adreno™ |
| Architecture | GPU fatiada (sliced-based architecture) |
| Maximum Clock | Up to 1.70 GHz (64-100) / up to 0.91 GHz (42-100) |
| Supported APIs | DirectX® 12.2, Vulkan® 1.4, OpenCL™ 3.0 |
| Graphic resources | Immersive graphics and advanced multimedia acceleration |
Artificial intelligence (NPU)
| Item | Specification |
|---|---|
| Name | Qualcomm® Hexagon™ NPU |
| Performance | 80 TOPS |
| Type of AI | On-device AI |
| Use cases | Photo and video editing, multimodal generation, autonomous agents, multitasking with AI |
| Supported experiences | 50+ AI experiments running locally |
Memory
| Item | Specification |
|---|---|
| Type | LPDDR5x |
| Bandwidth | Up to 152 GB/s |
Screen and video
| Item | Specification |
|---|---|
| Number of displays | Up to 3 simultaneous screens |
| Maximum resolution | Up to 4K at 144 Hz or 5K at 60 Hz |
| Video codecs | AV1, HEVC (H.265), AVC (H.264) |
Storage and expansion
| Item | Specification |
|---|---|
| Interface | M.2 |
| Standard | PCIe 3.0 |
| Speed | Up to 40 Gbps |
| Compatibility | SD Express, UHS-I |
Connectivity
| Item | Specification |
|---|---|
| 5G | Optional integrated |
| Wi-Fi | Wi-Fi 7 (High Band Simultaneous) |
| Bluetooth | Bluetooth® com Dual Bluetooth |
| Audio | Snapdragon Sound™ |
| Typical use | Cloud, remote collaboration, streaming and extreme mobility |
Security and management
| Item | Specification |
|---|---|
| Hardware security | Qualcomm® SPU |
| Integration | Microsoft Pluton |
| Authentication | Automatic attendance and biometrics |
| Protection | Chip-to-cloud |
| Remote management | Out-of-Band (OOB) |
| Optional technology | Snapdragon Guardian™ Technology |
Energy efficiency
| Item | Specification |
|---|---|
| Autonomy | Multi-day battery life |
| Thermal behavior | Cool, silent operation |
| Drum performance | No drop in performance when plugged in |
| Power management | Intelligent power distribution per workload |
Features and highlights
| Category | Details |
|---|---|
| CPU | Up to 10 3rd generation Oryon cores |
| GPU | Advanced architecture for realistic graphics |
| IA | 80 TOPS NPU focused on agentic AI |
| Mobility | Truly mobile platform |
| Multitasking | AI running in the background without impact |
| Security | Integrated corporate and personal protection |
| Connectivity | 5G, Wi-Fi 7 and next-generation Bluetooth |
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Price and availability
The first notebooks equipped with the new processor should reach the global market in the first half of 2026. The expectation is that the devices will occupy the price range between US$ 600 e US$ 800 (approximately R$3,200 to R$4,300 in direct conversion, without taxes).
Large partner manufacturers are expected to announce their models in the coming weeks, consolidating Qualcomm’s presence in the PC Games casual and corporate computers.
Source(s): Qualcomm
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Source: https://www.adrenaline.com.br/notebook/snapdragon-x2-plus-qualcomm-anunciado-ficha-tecnica/
