OKI Circuit Technology has announced a new printed circuit board (PCB) design that can increase component heat dissipation by up to 55 times. The Japanese company has been working with PCBs for more than 50 years and seeks to bring new high-performance technologies.
The product is intended for markets where even the best air coolers are not recommended, such as miniaturized devices or use in spacewhere there is no air. The technology consists of a PCB board filled with circular or rectangular-based, staggered copper coins.
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The Technology
It is not the first OKI product to use built-in copper coins as a heat dissipation solution. On OKI’s High Current/High Heat Radiation Board product page, you can see a PCB solution using embedded copper coins, thick copper foil wiring, and metal core wiring.
The innovation is the improvement of technology, using staggered thicknesses and allowing the choice of circular or rectangular coins, depending on design preference.
What the company refers to as “coins” are copper structures similar to a rivet or nail. By “staggered,” the company means that one end of the coin, or rivet, is a different size than the other.
As an example, OKI mentions a stepped coin with a diameter of 7mm on the connecting surface with an electronic component, and 10mm on the heat dissipation surface.
Through this structure, heat is conducted from the electronic component through the bonding surface and dissipated more efficiently on the wider dissipation surface.
Use and Effectiveness
OKI suggests that this PCB technology can be best used in miniaturized and space applications. It is in this situation that the company reports increasing heat dissipation by up to 55x.
Dissipating heat from components is one of the problems that engineers involved with high-power electronics often have to overcome, and in the case of satellites there are a number of challenges, such as the absence of an atmosphere.
Although, It is possible that other traditional applications will also benefit from the technology. Component manufacturers such as Asus, ASRock, Gigabyte and MSI often boast about their abundant use of copper in motherboards and other components, but they do not use a similar structure to OKI.
If other companies adopted the new stepped copper coins, they could extend across the PCB to conduct heat to large metal cases. Additionally, they could potentially connect to backplates and other cooling devices.
Fonte: OKI Circuit Technology.
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Source: https://www.adrenaline.com.br/hardware/novo-design-de-pcb-pode-melhorar-dissipacao-de-calor-em-ate-55-vezes/
