Micron Introduces MRDIMMs for Servers

Micron has introduced its MRDIMMs (“multiplexed rank dual inline memory module”), which will allow servers to achieve high performance with more demanding workloads and applications that use more than 128 GB per DIMM slot.

According to the manufacturer, the new module surpasses the current TSV RDIMM in bandwidth, more capacity and lower latency, in addition to having an improved performance per watt for acceleration of multiple memory-intensive virtualization, HPC and artificial intelligence servers. The first generation will be compatible with Intel Xeon 6 CPUs.

Micron notes that customers who choose MRDIMMs over RDIMMs will see the following advantages in their servers:

• Up to 39% increase in effective memory bandwidth;
• More than 15% better bus efficiency;
• Up to 40% improvement in latency compared to RDIMMs

Micron’s focus on servers

Micron’s MRDIMMs will support capacities from 32GB to 256GB in standard or TFF form factors – capable of bringing high performance to 1U and 2U servers.

They claim that their thermal design on TFF modules reduces DRAM temperatures by up to 20 degrees Celsius – using the same power consumption and airflow, allowing cooling solutions to be more efficient inside servers.

Micron also claims that its 32Gb DRAM die process with 256GB TFF MRDIMMs has the same power consumption as a 16Gb die with 128GB TFF MRDIMMs. Additionally, a 256GB TFF MRDIMM module has 35% higher performance than similar capacity versions in TSV RDIMMs.

Eyes on artificial intelligence

According to Praveen Vaidyanathan, vice president and general manager of Micron’s computing products division, MRDIMMs are designed to meet the demands of artificial intelligence that have grown over the past two years.

Micron’s latest memory solution, MRDIMM, delivers much-needed bandwidth and capacity at low latency to support AI inference and HPC applications on next-generation server platforms. The module significantly reduces power consumption per task while operating with the same reliability, availability, ease of maintenance and interface as RDIMMs, providing customers with a flexible solution with increased performance. Our close industry collaborations also ensure simplified integration with existing server infrastructures and smooth transitions to future computing platforms.

Praveen Vaidyanathan

Intel’s vice president and general manager of server products, focused on Xeon 6, Matt Longman, also spoke out and points out that there are many advantages to using the new module.

Adding to the DDR5 interfaces and technology, MRDIMMs provide seamless compatibility with existing Xeon 6 platforms, giving customers flexibility and choice. MRDIMMs provide customers with a comprehensive choice of higher bandwidth, lower latency and capacity points for HPC, AI and a variety of workloads – all on the same platform with Intel Xeon 6 CPUs that also support standard DIMMs. Customers will benefit from Micron’s extensive MRDIMM portfolio ranging from 32GB to 256GB in densities – in both standard and TFF form factors that can be validated on our Xeon 6 platforms.

Matt Longman

Fonte: TechPowerUp