Intel’s Advanced Packaging attracts Apple and Qualcomm and could usher in a new phase in the chip business

New job openings at both Apple and Qualcomm indicate that these two giants are interested in considering Intel’s chip packaging system for their future components. In a market largely dominated by TSMC, this could be an opportunity for the Core owner to find its share in the segment.

As shown in the screenshot below, Apple is looking for a new employee capable of “solving complex electrical and mechanical integration challenges of memory packages embedded in advanced technologies such as CoWoS, EMIB, SoIC and PoP.”

Qualcomm is also looking for a new employee familiar with advanced packaging technologies, and is more precise in its request, mentioning only EMIB and FCBGA.

EMIB is an acronym for Embedded Multi-Die Interconnect Bridge, Intel’s advanced packaging solution, while the one used by TSMC is CoWoS. It is worth mentioning that the Foveros Direct 3D technology was built on top of EMIB, so mentions of this solution may be referring to Foveros as well.

New demands for TSMC could pave the way for Intel

Intel has been trying to position itself as an alternative in chip manufacturing for some time, taking advantage of the technologies it uses in the production of its own processors to offer contracts to external customers as well.

The largest companies in the world, however, continue to be more interested in the quality of TSMC’s lithographs. But it seems that for packaging Intel may find its opportunity.

The industry’s obsession with AI has saturated TSMC’s production capacity, which has now had to turn its most modern processes not only to Apple and Qualcomm, but also to AMD and NVIDIA. The latter historically opted for processes from one or two generations ago in their GPUs, but now they would be ready to jump to the most current ones possible.

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