Intel took to social media to show how it intends to overtake the competition in manufacturing advanced chips in the coming years. Combining 2.5D and 3D manufacturing and packaging technologies, the company wants to create a multi-chiplet that is up to 12 times larger than the main chips for AI processing today.
The design is not only much bigger than what can be found today, but it also surpasses TSMC’s concepts for the future. The reticle size in Intel’s demonstration would reach 12X, while TSMC showed in April this year an idealization for 9.5X.
The planning shows us at least 16 computational elements on eight dies, with up to 24 HBM5 memory stacks. This memory, in fact, would be a customized version more advanced than the JEDEC minimum standards for the component, as is usually the implementation of memory technologies in practice.
The base dies communicate via EMIB-T, which is the Embedded Multi-die Interconnect Bridge (EMIB) technology with the addition of TSV: through-silicon vias, which can be translated as “vias through the silicon”. Intel says this will be the new generation of EMIB.
Intel employs 14A and 18A in its conceptual component
As Intel’s post focuses on showing a product with its most advanced technologies, the large computational elements that appear in the multi-chiplet would be made in the 14A process, possibly in the 14A-E class, revised for more efficiency and which will only be available later.
The components are placed on dies made using the 18A-PT, also the most advanced version of the company’s process that will make its debut in 2026. These dies can offer both additional computing and serve to accommodate more SRAM cache.
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Finally, Intel imagines its very advanced chip with PCIe 7.0 support, optical engines, accelerators for server security and even the option to incorporate LPDDR5X for extra DRAM.
The question now is whether the company can find something like this in practice before TSMC comes up with an even more impressive answer.
Via: Tom’s Hardware
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Source: https://www.adrenaline.com.br/intel/intel-mostra-conceito-para-multi-chiplet-12-vezes-maior-que-chips-ia-da-atualidade/
