A Intel It may be about to recover its protagonism in the semiconductor sector. Recent reports indicate that your manufacturing process 18a reached a density of SRAM equivalent to that of the N2 da tsmcdemonstrating a great technological advance.
The achievement, which was presented during the sessions of ISSCC 2025 shows that Intel is reducing the distance from competitionat least with regard to the miniaturization and efficiency of chips.
The progress of Intel Foundry Services (IFS) It comes at a strategic moment for the company, which in recent years has faced challenges in the technological race against TSMC and Samsung.
With the introduction of innovative technologies, such as Backside Power Delivery Network (BSPDN)Intel seeks not only Improve energy efficiencybut also recover space in the sector, driven by investments and political incentives in the United States.
BSPDN and the Energy Efficiency Revolution
One of the most relevant innovations of Intel 18A It is the implementation of Backside Power Delivery Network (BSPDN)a technology that moves the power distribution to the back of the wafer. The practically reduces interference and improves the signal integrityallowing greater efficiency and performance.
Process 18a also presents a version “high-density”with a macro density of 38.1 MB / mm²an important range for component miniaturization.
However, there is still a significant challenge ahead: Wide -scale production income rates. After all, even with promising advances, the real test will be Intel’s ability to deliver a high volume of chips with good productive efficiency.
The exchange is strong. THE TSMC It was not stopped and also presented improvements in its manufacturing technology.
O Process n2 brings an advance of 12% in the density of SRAMwhile high performance versions record an increase in 18%thanks to the transition of the traditional FinFET for the new technology nanosheets.
This provides Greater control and customization in chips designconsolidating TSMC as leader in the sector.
At the same time, Intel follows attracting TSMC’s tip engineersespecially in its operation in the Arizonaa strategy to strengthen your expertise in advanced manufacturing and improve your global competitiveness.
Intel 18a promises to be a watershed to the company, bringing innovation and competing directly with TSMC. However, the real challenge will be the scalability of production
Also read:
Can Intel recover his prominent position in the sector?
With the growth in demand for advanced chips, the dispute for manufacturing capacity has become one of the main challenges in the market.
A Nvidia, for example, will consume about 77% of WAFERS focused on AI processors in 2025which limits production availability to other companies.
Meanwhile, Intel tries not only to compete with TSMC, but also proving that it can still be a giant in the sector so as not to be acquired. The renowned Jim Kellerformer Intel-engineer, recently stated that the company can still be $ 1 trillionprovided that you can correctly execute your innovation strategies.
O process 18a It therefore represents a crucial step on this journey. If Intel can maintain high manufacturing income and deliver competitive chips, it can mark a historical turn In the dispute against TSMC, not selling its division to the rival company.
However, the big test is yet to come: Efficiency in large -scale production and the adoption of this technology by large clients in the sector.
Fonte: Wccftech
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Source: https://www.adrenaline.com.br/intel/intel-avanca-com-processo-18a-para-rivalizar-com-tsmc/
