Ase Technology works on square substrates to replace round wafers

ASE Technology has announced a $ 200 million investment in its new chip packaging technology that results in square substrates. The idea is to use these components in semiconductor creation instead of the traditional round wafers, widely used today.

The difference in geometric format should result in a considerably larger area of ​​use for each substrate, generating an increase in productivity and decreased waste of components. ASE says its 600 x 600mm square substrate offers a usable area up to five times larger than a 300mm traditional wafer.

In addition to an area resulting in more substrate processors, the new packaging technology should also help to create larger solutions for multi-choplet components, according to Tien Wu, CEO of Ase.

Tom’s hardware people say there are estimates that total investment capital for ASE Technology in 2025 is just over the $ 1.9 billion last year. Thus, directing US $ 200 million to its new square substrate represents an important bet for the company in technology.

Ase Technology needs partners for their technology

The development of Ase Technology’s new substrate involves the need for machinery to make the new components. There is currently no equipment that can process the substrates in the size provided by the company, so the company works with partners to create the necessary tools.

The ASE project goes through its ability to form these partnerships. The company says it expects to offer the first samples to product customers created on square substrates next year.

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It is interesting to approach Taiwanese company in substrate geometry. Meanwhile, its countryman TSMC and other giants such as AMD and Intel have sought advances in the material used in the manufacture of semiconductors, betting on the glass as the next major advance in the area.