The week is not starting off easy for AMD, which now finds itself involved in a lawsuit over the technologies it uses in its processors, mainly the hybrid link technology that appears in its popular CPUs with 3D V-Cache. The lawsuit comes from Adeia, which accuses the owner of Ryzen of infringing a total of 10 of its IPs.
Three of these intellectual properties are related to processor nodes and memory manufacturing, while seven are related to the use of hybrid connection. This technology is used in the Ryzen X3D series of processors – which should even gain new models at CES 2026.

The hybrid connection allows up to 64MB of SRAM to be stacked on top of each Zen architecture-based computing die (CCD) without causing overheating or overvoltage issues. According to Tom’s Hardware, manufacturing would use TSMC’s SoIC process, so the fight over the patent could involve the semiconductor manufacturer as well.
Adeia owns several patents involving hybrid bonding and interconnection, and generally licenses its technologies to electronics manufacturers. The company says AMD is making “extensive use” of proprietary techniques covered by its patent portfolio.
Lawsuit against AMD could impact several future components
The Adeia process is unlikely to affect products already launched by AMD, but its impact could affect the future of components not only from the company, but from other brands as well.

Depending on the Court’s understanding of what can be considered covered by the company’s patents, any processor with a hybrid connection could be affected. And that includes Intel, which despite not yet talking about 3D V-Cache openly, uses a version of the hybrid link in Foveros Direct.
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Everything will depend on the progress of the process, which is still in its initial phase and may not even continue in the US courts. It is worth mentioning that, in its announcement of the beginning of the process, Adeia has already stated that it is willing to negotiate a “fair and reasonable agreement” with AMD.
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Source: https://www.adrenaline.com.br/amd/amd-vira-alvo-de-processo-sobre-patentes-para-ligacao-hibrida-usada-em-3d-v-cache/
