See what a TSMC factory in the US looks like inside

Have you ever been curious about how large technological complexes work? If the answer is “yes”, see what a TSMC factory in the US looks like inside!

The semiconductor giant, TSMC, released a video that presents the internal operations of its factory Fab 21located no Arizona, USA.

The images show the manufacturing process of integrated circuits for North American companies, with hundreds of pieces of equipment acting in a coordinated manner.

Among the visible systems, the ASML extreme ultraviolet lithography machinesmodel Twinscan NXEappear as central elements in the production of the most complex components, such as processors Blackwell B300 and NVIDIA.

Without further introductions, check out the video published no X (formerly Twitter):

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A unit in initial phase of operation employs technology process N4 and N5referring to circuits 4 e 5 nanometers (nm).

The video moves through a clean room with yellow lighting, designed to filter certain types of light and prevent interference with the sensitive materials used in manufacturing.

A system of automated transportinternally called “silver highway” (silver highway), manages the movement of containers with 300mm silicon disks.

A Logistics for moving these materials is essential to maintain efficiency on a high-volume production line.

How Extreme Ultraviolet Lithography Works

The scenes show the ASML EUV lithography toolswith the models probably being NXE:3600Dcreating microscopic patterns on the silicon disks.

This process uses light with wavelength of 13.5 nm, generated through a plasma induced by laser on tin drops.

A technique allows print structures with dimensions close to 13 nm in a single step. Extreme ultraviolet lithography has particularities, such as the need to special mirrorsas conventional lenses absorb this type of light. Pattern overlay accuracy reaches 1.1 nm levels.

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TSMC Expansion and Future Plans in Arizona

Currently, the Fab 21 produces circuits for companies such as Apple, AMD e NVIDIA. The company is already working on building a second stage of the factorywhich will have the capacity to manufacture with technologies N3 e N2.

This advance represents a acceleration nos initial planswho predicted this evolution only in a third phase. THE president of TSMC, C.C. Weiaddressed these plans in recent communication with analysts.

The president of TSMC, C.C. Weistated that the company is preparing to accelerate the implementation of more advanced technologies in Arizona, driven by strong demand in the area of ​​artificial intelligence (AI).

The company also negotiates the acquisition of a second piece of land nearby to support expansion.

The strategy should result in a manufacturing complex classified as “Gigafab“, a term used by TSMC to units com ability to start production of more than 100 thousand wafers per month.

This production center must meet to customer demand of the sectors smartphones, IA e computing of high performance.

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Source: Tom’s Hardware