Samsung demonstrates its HBM4 modules to the public for the first time

Samsung went to the 2025 edition of the Semiconductor Exhibition (SEDEX) event to showcase its HBM4 memory modules. This is the first time that the company has demonstrated its technology openly to the public. indicating that development is proceeding as planned.

At the same event, SK hynix, Samsung’s main competitor, also showed its version of HBM4 memories. The two companies and Micron are in the race for the new generation of the technology most used in AI accelerator memories.

Samsung ended up falling behind in the currently available generation of components, based on HBM3E. That’s why the company is investing aggressively in HBM4, so as not to miss the hype train that propelled SK hynix to the position of “largest DRAM manufacturer in the world” – a title that belonged to Samsung for 30 years.

HBM4 from Samsung shows promise

The next generation of memory components for AI accelerators will be decisive for the success of Samsung’s foundry division. This would even be one of the reasons why the companies would even be willing to sacrifice a large part of their profits to secure a contract with NVIDIA.

Meanwhile, the company has already secured orders for AMD’s Instinct MI450 chips, which promise to stand up to the Vera Rubin generation of NVIDIA GPUs.

However, it is not enough to win these contracts without being able to deliver the number of components necessary to fulfill them. But Samsung’s HBM4 modules seem to be doing well in this area too, and we already have rumors that their production exceeds 90% in yield. That’s an excellent number for manufacturing a new hardware component.

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The race for HBM4 shows no signs of slowing down. At the same time that Samsung’s new components show promise, SK hynix has reportedly already begun fulfilling orders from NVIDIA for Vera Rubin accelerators.

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Via: WCCFTech

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