New PCIe Gen4 microSSD combines extreme performance and ultra-compact design

A Longsys has just announced the first microSSD with industry-leading integrated packaging, a tiny device that promises top-notch performance even in a form factor smaller than a microSD card. The new microSSD PCIe Gen4 weighs just 2.2 grams, measures 20×30mm, and is just 2mm thick, yet offers speeds that rival traditional notebook SSDs.

With PCIe Gen4 x4 interface support, the microSSD achieves sequential reads of up to 7,400 MB/s e recordings up to 6,500 MB/sperformance comparable to newer M.2 drives. While still below cutting-edge PCIe 5.0 models, such as TeamGroup’s new SSDs that top out at 10,000 MB/s and even TeamGroup’s PCIe 5.0 SSD that tops out at 14,900 MB/s, microSSD’s focus is on delivering speed and efficiency in ultra-compact devices.

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Integrated design and elimination of welds

Unlike conventional SSDs mounted on circuit boards (PCB), microSSD uses technology System-in-Package (SiP) wafer-level, which integrates the controller, NAND memory, power management chip and other components within a single package. This innovation eliminates almost a thousand welding pointsreducing the risk of defects, overheating and failures due to humidity.

Longsys claims this change reduces the defect rate of 1,000 DPPM (defective parts per million) for just 100 DPPMraising the quality standard from board level to chip level. Furthermore, the process eliminates several manufacturing steps, such as PCB positioning and soldering, simplifying production and reducing costs.

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More efficient and sustainable production

Thanks to direct integration from the wafer to the final product, the microSSD doubles delivery efficiency and reduces the additional costs by more than 10%. The absence of energy-intensive assembly steps also reduces carbon emissionsmeeting the sustainability requirements of global manufacturers.

Longsys calls this concept “Office is Factory”a flexible model that allows client brands to carry out customizations, printing and assembly directly in their offices or points of sale, without the need for large production lines.

Thermal performance and low consumption

Despite its small size, the microSSD has an advanced thermal dissipation system with aluminum alloy, graphene patches e thermoconductive silicone. This combination maintains peak performance for long periods, even under heavy loads.

Power consumption has also been optimized: the device meets the standard NVMe L1.2with consumption at rest below 3,5 mW and peaks within specification limits.

Versatility and modular expansion

Another difference is the flexibility of use. The microSSD supports memory TLC e QLCwith capabilities that vary between 512 GB e 4 TB. It also comes with a heatsink modular clip-onwhich allows you to expand the format to sizes M.2 2230, 2242 or 2280 no tools required.

This adaptability makes microSSD ideal for ultra-thin notebooks, portable consoles, drones, virtual reality headsets and IoT devicessectors that require light, fast and high thermal efficiency storage.

Longsys PCIe Gen4 microSSD datasheet

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Category	Specifications
Model	microSSD (mSSD)
Manufacturer	Longsys
Dimensions	20 × 30 × 2 mm
Weight	2,2 g
Material	Aluminum alloy with high thermal conductivity
Format expansion	Compatible with M.2 2230 / 2242 / 2280 (clip-on modular heatsink)
Available Capacities	512 GB / 1 TB / 2 TB / 4 TB
Interface	PCIe Gen4 x4 (NVMe)
Sequential reading speed	Up to 7,400 MB/s
Sequential write speed	Up to 6,500 MB/s
Random Read (IOPS)	Up to 1,000K
Random write (IOPS)	Up to 820K
Consumption at rest (NVMe L1.2)	≤ 3,5 mW
Production efficiency	+100% in delivery speed
Manufacturing cost reduction	-10% in production processes
Dissipation materials	Aluminum, graphene and thermoconductive silicone
Thermal Performance (1TB M.2 2230)	Peak: 28 s / Steady: 1,500 MB/s
Thermal Performance (1TB M.2 2280)	Peak: 121 s / Steady: 3,750 MB/s
Defect rate (DPPM)	≤ 100 (10× smaller than conventional SSD ≤ 1,000)
Assembly technology	System-in-Package (SiP) – eliminates 1,000 soldering points
Resistance	Water, dust, shock, impact and electrostatic discharge
Customization	Color/UV printing with customized design
Production model	“Office is Factory” — allows local assembly and customization

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Via: techradar

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