Samsung to start shipping samples of its HBM4 in early 2025 [RUMOR]

Samsung is expected to finish designing its HBM4 memory and ship it to manufacturing later this year, according to rumors. Unofficial information from Korean website The Elec suggests that the company will start shipping samples to customers in early 2025.

After completing the design and starting production of the HBM4 components, the first units will still undergo internal testing at Samsung itself. That’s why the sample estimate is only for early next year. Thus, the manufacturer is expected to begin mass production of HBM4 at the end of 2025.

The South Korean company is expected to manufacture its HBM4 modules with 24Gb and 32Gb layers, in TSV stacks of 8, 12 and 16 layers. According to Tom’s Hardware, Samsung will use its current most advanced DRAM process, 10nm, for manufacturing. Meanwhile, the die would be made on its 4nm node with a 2048-bit interface. It is not yet possible to talk about speeds for the finished products, but JEDEC estimates up to 6.4GT/s for the new standard.

HBM memories are widely used in AI and HPC processors, so customers in these areas are expected to receive HBM4 samples first.

Samsung takes on SK Hynix in race for HBM4

The source of the rumors also brought information about SK Hynix. Samsung’s domestic rival is in the race for the HBM4 and should also start its production in the second half of this year. However, the site could not say whether the window for sending the first samples would be the same.

More about HBM:

For its HBM4 memory dies, SK Hynix will collaborate with TSMC. The Taiwanese chipmaker plans to make the memory dies using two of its most advanced processes – 12GCC+ (12nm) and N5 (5nm). These processes aren’t as small as Samsung’s, but they could result in more affordable components.

Source: Tom’s Hardware