SK Hynix promises up to 30x more performance in next-generation HBM

SK Hynix is ​​investing heavily in the development of future generations of HBM memory, and intends to lead the way in product performance. Speaking at the SK Icheon Forum 2024, the company’s vice president promised performance gains of up to 30 times over the current generation of HBM.

“We aim to develop products with 20 to 30 times better performance than the current HBM, with a focus on introducing differentiated products,” said Ryu Seong-su.

Unfortunately, the executive’s speech does not mention which memory version he is specifically talking about. With HBM4 set to arrive next year, it is most likely to be a variant that follows this generation, or even a future one arriving later.

Wideband memories have been the preferred choice for manufacturing products aimed at AI processing. In other words, following the hype surrounding the technology, interest in these components has also been high.

For this reason, Vice President Seong-su took the opportunity to say that SK Hynix has received “huge interest” from tech companies in the AI ​​segment. He basically listed all the big ones in his talk: Apple, Microsoft, Alphabet (Google) and, of course, Nvidia.

The race for the HBM of the future

It is clear that so much interest in HBM generates competition in the segment. While accelerating the development of HBM4, SK Hynix already finds in Samsung a strong competitor for the current HBM3E.

More about memories:

SK Hynix appears to have taken the lead in supplying Nvidia with products after the RTX maker encountered issues with Samsung’s memory. However, the company has now resolved the issue and is back in the running with its HBM3E memory.

According to WCCFTech, the two companies have plans to launch HBM4 between mid and late 2025, so the quality of the products will again be decisive for who comes out ahead.